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| INTEGRATED CIRCUITS DATA SHEET 74LVC1G07 Buffer with open-drain output Product specification Supersedes data of 2003 Mar 07 2004 Sep 07 Philips Semiconductors Product specification Buffer with open-drain output FEATURES * Wide supply voltage range from 1.65 V to 5.5 V * High noise immunity * Complies with JEDEC standard: - JESD8-7 (1.65 V to 1.95 V) - JESD8-5 (2.3 V to 2.7 V) - JESD8B/JESD36 (2.7 V to 3.6 V). * 24 mA output drive (VCC = 3.0 V) * CMOS low power consumption * Latch-up performance exceeds 250 mA * Direct interface with TTL levels * Inputs accept voltages up to 5 V * Multiple package options * ESD protection: - HBM EIA/JESD22-A114-B exceeds 2000 V - MM EIA/JESD22-A115-A exceeds 200 V. * Specified from -40 C to +85 C and -40 C to +125 C. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL tPLZ/tPZL PARAMETER propagation delay inputs A to output Y CONDITIONS VCC = 1.8 V; CL = 30 pF; RL = 1 k VCC = 2.5 V; CL = 30 pF; RL = 500 VCC = 2.7 V; CL = 50 pF; RL = 500 VCC = 3.3 V; CL = 50 pF; RL = 500 VCC = 5.0 V; CL = 50 pF; RL = 500 CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; (CL x VCC2 x fo) = sum of the outputs. 2. The condition is VI = GND to VCC. input capacitance power dissipation capacitance per gate VCC = 3.3 V; notes 1 and 2 DESCRIPTION 74LVC1G07 The 74LVC1G07 is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device as translator in a mixed 3.3 V and 5 V environment. Schmitt trigger action at the input makes the circuit tolerant for slower input rise and fall time. The 74LVC1G07 provides the non-inverting buffer. The output of the device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. TYPICAL 2.6 1.7 2.3 2.2 1.6 5 7 ns ns ns ns ns UNIT pF pF 2004 Sep 07 2 Philips Semiconductors Product specification Buffer with open-drain output FUNCTION TABLE See note 1. INPUT A L H Note 1. H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state. ORDERING INFORMATION TYPE NUMBER 74LVC1G07GW 74LVC1G07GV 74LVC1G07GM PINNING PIN (TSSOP5 AND VSSOP5) 1 2 3 4 5 PIN (XSON6) 1 2 3 4 5 6 A GND Y n.c. VCC SYMBOL n.c. data input A ground (0 V) data output Y not connected supply voltage TEMPERATURE RANGE -40 C to +125 C -40 C to +125 C -40 C to +125 C PACKAGE PINS 5 5 6 PACKAGE SC-88A SC-74A XSON6 MATERIAL plastic plastic plastic OUTPUT Y L Z 74LVC1G07 CODE SOT353 SOT753 SOT886 MARKING VS V07 VS DESCRIPTION not connected 07 1 2 5 n.c. 1 6 VCC n.c. A VCC 07 4 001aab622 A 2 5 n.c. GND 3 Y GND 3 4 Y 001aab623 Transparent top view Fig.1 Pin configuration TSSOP5 and VSSOP5. Fig.2 Pin configuration XSON6. 2004 Sep 07 3 Philips Semiconductors Product specification Buffer with open-drain output 74LVC1G07 handbook, halfpage 2 A Y 4 handbook, halfpage A 2 4 Y MNA623 MNA624 Fig.3 Logic symbol. Fig.4 IEC logic symbol. handbook, halfpage Y A GND MNA625 Fig.5 Logic diagram. 2004 Sep 07 4 Philips Semiconductors Product specification Buffer with open-drain output RECOMMENDED OPERATING CONDITIONS SYMBOL VCC VI VO Tamb tr, tf PARAMETER supply voltage input voltage output voltage operating ambient temperature input rise and fall times VCC = 1.65 V to 2.7 V VCC = 2.7 V to 5.5 V active mode VCC = 0 V; Power-down mode CONDITIONS 0 0 0 -40 0 0 MIN. 1.65 74LVC1G07 MAX. 5.5 5.5 5.5 5.5 +125 20 10 V V V V UNIT C ns/V ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO IO ICC, IGND Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. PARAMETER supply voltage input diode current input voltage output diode current output voltage output sink current VCC or GND current storage temperature power dissipation Tamb = -40 C to +125 C VI < 0 V note 1 VO > VCC or VO < 0 V active mode; notes 1 and 2 VO = 0 V to VCC CONDITIONS - -0.5 - -0.5 - - -65 - MIN. -0.5 MAX. +6.5 -50 +6.5 50 +6.5 +6.5 50 100 +150 250 V mA V mA V V mA mA C mW UNIT Power-down mode; notes 1 and 2 -0.5 2004 Sep 07 5 Philips Semiconductors Product specification Buffer with open-drain output DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = -40 C to +85 C VIH HIGH-level input voltage 1.65 to 1.95 2.3 to 2.7 2.7 to 3.6 4.5 to 5.5 VIL LOW-level input voltage 1.65 to 1.95 2.3 to 2.7 2.7 to 3.6 4.5 to 5.5 VOL LOW-level output voltage VI = VIH or VIL IO = 100 A IO = 4 mA IO = 8 mA IO = 12 mA IO = 24 mA IO = 32 mA ILI IOZ Ioff ICC ICC input leakage current output leakage current power OFF leakage current quiescent supply current additional quiescent supply current per pin VI = 5.5 V or GND VI = VIH; VO = 5.5 V or GND VI or VO = 5.5 V VI = VCC or GND; IO = 0 A VI = VCC - 0.6 V; IO = 0 A 1.65 to 5.5 1.65 2.3 2.7 3.0 4.5 1.65 to 5.5 1.65 to 5.5 0 5.5 2.3 to 5.5 - - - - - - - - - - - - - - - - - 0.1 0.1 0.1 0.1 5 0.65 x VCC 1.7 2.0 0.7 x VCC - - - - - - - - - - - - VCC (V) MIN. TYP.(1) 74LVC1G07 MAX. UNIT - - - - 0.35 x VCC 0.7 0.8 0.3 x VCC 0.1 0.45 0.3 0.4 0.55 0.55 5 10 10 10 500 V V V V V V V V V V V V V V A A A A A 2004 Sep 07 6 Philips Semiconductors Product specification Buffer with open-drain output 74LVC1G07 TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = -40 C to +125 C VIH HIGH-level input voltage 1.65 to 1.95 2.3 to 2.7 2.7 to 3.6 4.5 to 5.5 VIL LOW-level input voltage 1.65 to 1.95 2.3 to 2.7 2.7 to 3.6 4.5 to 5.5 VOL LOW-level output voltage VI = VIH or VIL IO = 100 A IO = 4 mA IO = 8 mA IO = 12 mA IO = 24 mA IO = 32 mA ILI IOZ Ioff ICC ICC Note 1. All typical values are measured at VCC = 3.3 V and Tamb = 25 C. input leakage current output leakage current power OFF leakage current quiescent supply current additional quiescent supply current per pin VI = 5.5 V or GND VI = VIH; VO = 5.5 V or GND VI or VO = 5.5 V VI = VCC or GND; IO = 0 A VI = VCC - 0.6 V; IO = 0 A 1.65 to 5.5 1.65 2.3 2.7 3.0 4.5 1.65 to 5.5 1.65 to 5.5 0 5.5 2.3 to 5.5 - - - - - - - - - - - 0.65 x VCC 1.7 2.0 0.7 x VCC - - - - VCC (V) MIN. TYP.(1) MAX. UNIT - - - - - - - - - - - - - - - - - - - - - - - 0.35 x VCC 0.7 0.8 0.3 x VCC 0.1 0.70 0.45 0.60 0.80 0.80 100 100 200 200 5000 V V V V V V V V V V V V V V A A A A A 2004 Sep 07 7 Philips Semiconductors Product specification Buffer with open-drain output AC CHARACTERISTICS GND = 0 V; tr = tf 2.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Tamb = -40 C to +85 C tPLZ/tPZL propagation delay A to Y see Figs 6 and 7 1.65 to 1.95 2.3 to 2.7 2.7 3.0 to 3.6 4.5 to 5.5 Tamb = -40 C to +125 C tPLZ/tPZL propagation delay A to Y see Figs 6 and 7 1.65 to 1.95 2.3 to 2.7 2.7 3.0 to 3.6 4.5 to 5.5 1.0 0.5 0.5 0.5 0.5 - - - - - 1.0 0.5 0.5 0.5 0.5 2.6 1.7 2.3 2.2 1.6 VCC (V) MIN. TYP. 74LVC1G07 MAX. UNIT 6.7 5.5 4.7 4.2 3.5 ns ns ns ns ns 2 7 6 5.5 4.5 ns ns ns ns ns 2004 Sep 07 8 Philips Semiconductors Product specification Buffer with open-drain output AC WAVEFORMS 74LVC1G07 handbook, full pagewidth VI A input GND t PLZ VCC Y output VOL VX MNA626 VM t PZL VM VCC 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V VM 0.5 x VCC 0.5 x VCC 1.5 V 1.5 V 0.5 x VCC VX VOL + 0.15 V VOL + 0.15 V VOL + 0.3 V VOL + 0.3 V VOL + 0.3 V VCC VCC 2.7 V 2.7 V VCC VI Fig.6 Input A to output Y propagation delay times. 2004 Sep 07 9 Philips Semiconductors Product specification Buffer with open-drain output 74LVC1G07 handbook, full pagewidth VEXT VCC PULSE GENERATOR VI D.U.T. RT CL RL VO RL MNA616 VCC 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V VI VCC VCC 2.7 V 2.7 V VCC CL 30 pF 30 pF 50 pF 50 pF 50 pF RL 1 k 500 500 500 500 VEXT tPLH/tPHL open open open open open tPZH/tPHZ GND GND GND GND GND tPZL/tPLZ 2 x VCC 2 x VCC 6V 6V 2 x VCC Definitions for test circuit: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.7 Load circuitry for switching times. 2004 Sep 07 10 Philips Semiconductors Product specification Buffer with open-drain output PACKAGE OUTLINES TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm 74LVC1G07 SOT353-1 D E A X c y HE vMA Z 5 4 A2 A1 (A3) A 1 e e1 bp 3 wM detail X Lp L 0 1.5 scale 3 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.1 0 A2 1.0 0.8 A3 0.15 bp 0.30 0.15 c 0.25 0.08 D(1) 2.25 1.85 E(1) 1.35 1.15 e 0.65 e1 1.3 HE 2.25 2.0 L 0.425 Lp 0.46 0.21 v 0.3 w 0.1 y 0.1 Z(1) 0.60 0.15 7 0 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC MO-203 JEITA SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 2004 Sep 07 11 Philips Semiconductors Product specification Buffer with open-drain output 74LVC1G07 Plastic surface mounted package; 5 leads SOT753 D B E A X y HE vMA 5 4 Q A A1 c 1 2 3 detail X Lp e bp wM B 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.100 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT753 REFERENCES IEC JEDEC JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 2004 Sep 07 12 Philips Semiconductors Product specification Buffer with open-drain output 74LVC1G07 XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4x L1 L (2) e 6 e1 5 e1 4 6x (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 2004 Sep 07 13 Philips Semiconductors Product specification Buffer with open-drain output DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION 74LVC1G07 This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2004 Sep 07 14 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2004 SCA76 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R20/06/pp15 Date of release: 2004 Sep 07 Document order number: 9397 750 13756 |
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